Image sensors and highly integrated semiconductor elements are made from Epitaxial Wafer, which can be used in energy-saving and power devices.

In the epitaxy process, a silicon wafer's polished crystal surface is covered with a layer of new monocrystalline silicon. Because the material properties can be chosen independently of the polished substrate during this procedure, wafers with various substrate and epitaxial layer qualities can be produced. For the semiconductor component to work in many circumstances, this is essential.

With a diameter of up to 300mm, Siltronic provides Epitaxial Wafer. Even though highly integrated semiconductor elements (ICs) typically use 300mm EPI wafers, smaller diameters are also employed for power applications. Substrates and epitaxial layers are created to customer specifications in order to satisfy the varied needs.

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